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U.O.C. provide semiconductor laser diodes Epitaxy growth, wafer and chip process, LD assembly (i.e. CoS, SMD, TO-cans) manufacturing and OEM/ODM service.
UOC's wafer process service include: photo lithography, wet and dry etching, passivation, metalization, lapping and polishing service.
Facet Coating service: bar arrangement and facet coating.
Chip process: Chip arrangement, chip sorting.
LD Assembly: To-package, Cos assembly and LD testing.
https://0222217556.web66.com.tw/web/SEC?postId=341934電線組合、組件、配線
鈺仁企業有限公司是一家專業研發、生產、銷售電腦及周邊設備用連接線纜、通訊及網路電纜、多媒體電纜、家電
